The phenomenon of poor tin consumption is that some of the surface of the line is not tinned, because the surface is attached with grease, impurities, etc., and can be washed with a solvent. Flux adjustment conditions are not properly adjusted, such as air pressure and height required for foaming. Specific gravity is also a very important factor because the amount of flux on the surface of the line is affected by the specific gravity. Checking the specific gravity can also eliminate the possibility of misuse of improper flux due to wrong labeling and poor storage conditions. Solder time or temperature is not enough. Generally, the operating temperature of the solder is 55 to 80 ° C higher than the melting point temperature.
Why does PCB eat tin?
- Aug 25, 2018 -