The Printed Circuit Board Surface Treatment

- Sep 23, 2015 -

As the copper surface in the General environment, is easily oxidized, cannot be on the Tin (solder side), so will eat Tin on copper surface protection. Protection by means of a spray Tin (HASL), gold (ENIG), Silver (Immersion Silver), Tin (Immersion Tin), organic solderability preservatives (OSP), each approach has advantages and disadvantages, are collectively referred to as surface treatment.

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