Printed Circuit Board Manufacturing Process
1- 32 layers
white/yello/black/red/green/matt black/matt green
Immersion gold/Hasl LF/OSP/immersion tin/immersion silver.
Printed circuit boards are the providers of electrical connections for electronic components. Its design is mainly layout design; the main advantage of using the circuit board is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate.
It has several silkscreen and soldermask colors for you to choose, which can make your products different and diverse. The test voltage is among the wide range of 50 to 300V. It has oxidation resistance, thermal shock resistance and moisture resistance.
Manufacturing Process of the Printed Circuit Board
1. Substrate: The substrate is generally classified by the insulating part of the substrate. The common raw materials are electric wood board, fiberglass board, and various plastic boards. We usually use an insulating part composed of glass fiber, non-woven material, and resin, and then press it into a "bonding sheet" with epoxy resin and copper foil.
2. Metal coating: In addition to the wiring on the substrate, the metal coating is where the substrate wiring is soldered to the electronic components. The solderability, contact properties, resistance values, etc. of each metal will directly affect the performance of the component.
3. Circuit design: The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit user.
Standard export packing:
1.Standard : bubble bag,